Stable thin film encapsulation of acceleration sensors using polycrystalline silicon as sacrificial and encapsulation layer

Author: 
A. Höchst, R. Scheuerer, H. Stahl, F. Fischer, L. Metzger, R. Reichenbach, F. Lärmer, S. Kronmüller, S. Watcham, C. Rusu
Type of publication: 
Journal article
Year: 
2013
Published in: 
Sensors and Actuators A: Physical, Volume 114, Issues 2-3, 1 September 2004, Pages 355-361