Methods for characterization of wafer-level encapsulation applied on Si to LTCC Anodic bonding

Author: 
M.F. Khan, F. A. Ghavanini, S. Haasl, L. Löfgren, K. Persson, C. Rusu, K. Schjølberg-Henriksen, and P. Enoksson
Type of publication: 
Journal article
Year: 
2010
Published in: 
J. Micromech. Microeng. 20 (2010) 064020