Investigation of a Finned Baseplate Material and Thickness Variation for Thermal Performance of a SiC Power Module

Author: 
Zhang Y. F., Belov I., Bakowski M., Lim J.-K., Leisner P., Nee H.-P.
Type of publication: 
Conference item
Year: 
2014
Published in: 
Proc. 15th IEEE Int. Conf.EuroSimE 2014, Ghent, Belgium, Apr. 2014