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HDI - Products

The applications below are examples based on thin film HDI products, which we have developed.

Within the frame of the Europractice HDP Service, Acreo (at that time IMC) developed a thin film substrate for a Pentium processor MCM-D for embedded systems.

Download data sheet of the world's smallest Pentium MCM:
Pentium.pdf (331k).

Together with SAAB Combitech AB (today Kitron Development) a 486 computer was designed and realized in MCM-D technology for use in embedded avionics systems, where high computational capacity is required in combination with small size and low weight.

Within the RD16 project (FERMI) at CERN a generic digital front-end readout system for high resolution calorimetry was developed.

The FERMI module was especially aimed for the TILE calorimeter in the ATLAS detector at LHC (Large Hadron Collider)

This is a double sided thin film on flex substrate for an opto-electric receiver module.

The concept is based on self alignment and MT- compatibility. Is was also originally aimed for detectors at CERN.

Links for Thin film High Density Interconnect:
Core Competence Mainpage
Related projects:

LIPS - Low Cost Interconnect, Packaging and Sub-system Integration Technologies for Millimetre-wave Applications.

LAP - Large Area Panel Processing of MCM-D Substrates and Packages.
Netpack Europe
Other links:
The latest physics and technology news
European Community Research and Development Information Service

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Examples of applications