Large Area Processing
To develop and demonstrate low cost high density MCM-D substrate manufacturing technology for 1st level die assembly, Acreo has invested in process equipment for panel sizes up to 24" × 24". Equipment for the following processes are available: Develop/Etch, Lithography, Metal Deposition, Spin coating.
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| Sputter deposition system |
Spin coater for up to 33 inch diameter substrates |
Anvik Hexscan excimer patterning system |
Wet etching module |
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2004-03-11 |
Lithography |
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"ANVIK HEXSCAN 2050 SME" - Large-area, high resolution patterning system. |
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2004-03-11 |
Metal Deposition |
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KDF 844NT sputtering system is a computerized high vacuum system dedicated to high rate DC magnetron sputter deposition on large substrate with size up to 24" by 24" in production line. |
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2004-03-11 |
Spin coating |
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The Karl Suss RC33 is a spin coater designed for flat panel deposition processes on large area substrates, in our case 24" x 24" panels. |
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