Combined with a well equipped lab we are able to design, model and characterize components, circuits and subsystems working at frequencies up to 50GHz, on-chip.
To meet the high performance requirements of the next generation communication systems, the RF-IC-designs are made in state-of-the-art processes like SiGe Bi-CMOS and RF-CMOS.
Also, in line with the System-on-Package approach, research and development is made on Interconnect & Packaging, were the main focus is on design and modeling of integrated passives, including antennas, and chip-package co-design.
Read about the SoCTRix Transceiver Project !
Within the area of RF-IC design we can offer:
- RF-IC design (LNA, Mixers, VCO, etc)
- Advanced MW/RF-IC research (tunable filters, image rejection mixers)
- System-on-Package design
- RF-characterization up to 50GHz on-chip (see instrument list below)
- Modeling of passive and active components
- Front-end design, including antennas for microwave and mm-wave frequencies